China’s Ministry of Commerce (MOFCOM) on Wednesday announced the distribution of questionnaires as part of its anti-dumping investigation into imported analogue integrated circuit (IC) chips from the United States, marking the next step in the probe launched on September 13, 2024.
The notice divides the questionnaires into three categories: foreign exporters or producers, Chinese domestic producers, and Chinese importers. Each group is required to provide complete and accurate responses within 37 days from the date of distribution.
According to MOFCOM, failure to submit responses on time or as per requirements could result in the investigating authority making determinations based on available evidence and best information obtained under Article 21 of China’s Anti-Dumping Regulations.
Timeline and Scope of Investigation
The ministry stated that the dumping investigation will cover the period from January 1 to December 31, 2024, while the injury assessment will span January 1, 2022, to December 31, 2024.
The entire investigation is expected to conclude within 12 months, though it may be extended to 18 months under special circumstances.
Strengthening Fair Trade Enforcement
This move comes as China continues to reinforce its trade defence measures amid growing global scrutiny of semiconductor supply chains. The investigation seeks to determine whether US-origin analogue IC chips are being sold in China at unfairly low prices, potentially harming domestic manufacturers.
Industry observers see this as part of China’s broader effort to safeguard its semiconductor sector while maintaining fair competition in the high-tech market.
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